XC7Z015-2CLG485I

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XC7Z015-2CLG485I

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IC SOC CORTEX-A9 766MHZ 485CSBGA

  • 제조업체AMD Xilinx

  • 제조업체 부품 #XC7Z015-2CLG485I

  • 패키지 CSBGA-485

  • 재고1852

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사양

속성 가치
Package / Case Tray
Series Zynq®-7000
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 766MHz
Primary Attributes Artix™-7 FPGA, 74K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)

개요

Description

The XC7Z015-2CLG485I is a part of the Xilinx Zynq-7000 family, which combines a dual-core ARM Cortex-A9 processor with 28nm FPGA fabric on a single chip. This integration allows for high performance and flexibility, making it suitable for applications requiring both processing and programmable logic capabilities.
The "-2" indicates the speed grade, while "CLG485" refers to the package type, a wire-bond BGA with 485 pins. The "I" denotes an industrial temperature range, suitable for operation in challenging environments.
The XC7Z015 features include approximately 74k logic cells, 4.9 Mb of block RAM, and 220 DSP slices, providing ample resources for complex designs. It supports various I/O standards and has integrated peripherals like USB, Ethernet, and I2C.
Ideal for applications in industrial, automotive, and medical domains, the XC7Z015 offers a balance of processing capability and FPGA flexibility, enabling the implementation of custom hardware accelerators, real-time data processing, and system integration on a single chip.

Equivalent

The XC7Z015-2CLG485I is a Xilinx Zynq-7000 series system-on-chip (SoC). Equivalent products could include other Zynq-7000 series models such as the XC7Z020 or similar SoC offerings from other manufacturers like Altera's Cyclone V SE or NXP's i.MX 6 series, depending on the specific application requirements. These alternatives provide integrated ARM processing alongside FPGA capabilities, similar to the XC7Z015. Always verify specifications to ensure compatibility with your project's needs.

Features

The XC7Z015-2CLG485I is a member of the Xilinx Zynq-7000 SoC family. Key features include:
1. Architecture: Combines a dual-core ARM Cortex-A9 processor with Xilinx 7-series FPGA logic.
2. Processing System: The ARM processing system operates up to 1 GHz, supporting advanced computing tasks.
3. FPGA Fabric: Includes approximately 74,000 logic cells providing substantial programmable logic capability.
4. Memory: Offers DDR3, DDR3L, DDR2, and LPDDR2 memory interfaces for flexible storage solutions.
5. I/O Ports: Supports high-speed connectivity with up to 200 I/O pins, including USB, Ethernet, and PCIe.
6. Temperature Range: Features an industrial-grade operating temperature range of -40°C to +100°C.
7. Package: Comes in a CLG485 package with a compact 19x19 mm footprint, suitable for space-constrained applications.
8. Applications: Ideal for embedded systems, automotive, industrial, and communication applications due to its versatile processing and connectivity capabilities.
This combination of processing capability and programmable logic makes the XC7Z015-2CLG485I a powerful option for complex, high-performance applications.

Pinout

The XC7Z015-2CLG485I is a part of Xilinx's Zynq-7000 SoC (System on Chip) family. It is a heterogeneous multi-core device that combines dual ARM Cortex-A9 processors with FPGA fabric.
This particular model, the XC7Z015, comes in a CLG485 package, which has 485 pins. These pins provide various functions, including:
1. Processor Interfaces: Includes connections for the dual ARM Cortex-A9 processors, enabling communication with external memory and peripherals.

2. FPGA I/O: Supports configurable I/O pins that can be used for a variety of digital signal communications.
3. Memory Interfaces: Supports DDR3, DDR3L, and LPDDR2 memory types, connecting the processing system to external memory.
4. High-Speed Connectivity: Offers multiple high-speed interface options such as Gigabit Ethernet, USB, and PCIe.
5. Analog Interfaces: Includes pins for analog-to-digital converters (ADCs).
6. Power and Ground: Dedicated pins for supplying power to the chip and establishing ground connections.
This combination of features makes the XC7Z015-2CLG485I suitable for applications requiring robust processing power along with flexible FPGA capabilities.

Manufacturer

The XC7Z015-2CLG485I is manufactured by Xilinx, Inc. Xilinx is a semiconductor company known for its development of programmable logic devices, including Field-Programmable Gate Arrays (FPGAs), Adaptive Compute Acceleration Platforms (ACAPs), and other related technologies. FPGAs are integrated circuits that can be configured after manufacturing, allowing for flexibility in hardware design. Xilinx's products are used in various applications, including telecommunications, data centers, automotive, aerospace, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices, Inc.), a company known for its processors and graphics technologies, further expanding their capabilities in adaptive computing solutions.

Application

The XC7Z015-2CLG485I is a Zynq-7000 SoC from Xilinx, featuring a dual-core ARM Cortex-A9 processor integrated with 28nm FPGA logic. It is suited for a wide range of applications, including:
1. Embedded Vision Systems: Utilized in image processing and machine vision.
2. Industrial Automation: Supports real-time data processing and control systems.
3. Medical Devices: Used for patient monitoring and diagnostic equipment.
4. Automotive Systems: Powers advanced driver-assistance systems (ADAS) and infotainment.
5. Communication Systems: Facilitates high-speed data transfer and signal processing.
6. Aerospace & Defense: Used in avionics and secure communication systems.
Its versatility and integration of CPU and FPGA make it ideal for applications requiring high performance and flexibility.

Package

The XC7Z015-2CLG485I is a part of the Xilinx Zynq-7000 SoC family and comes in a CLG485 package type. This is a BGA (Ball Grid Array) package with 485 balls/pins, which is used for mounting the chip onto a circuit board.

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