사양
| 속성 | 가치 |
| Package / Case | Tray |
| Series | Zynq®-7000 |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 667MHz |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
개요
Description
The XC7Z030-1FBG676I is a member of Xilinx's Zynq-7000 family, combining an ARM-based processing system (PS) with programmable logic (PL) in a single chip.
### Key Features:
- Dual-core ARM Cortex-A9 (up to 1GHz) with NEON/FPU.
- Programmable Logic: Artix-7 FPGA fabric (~125K logic cells).
- Memory: 256KB on-chip RAM, DDR3/LPDDR2 support.
- I/O: High-speed interfaces (Gigabit Ethernet, USB, UART, SPI, I2C).
- Package: 676-pin BGA (FBG676).
### Applications:
Embedded systems, industrial automation, automotive, and IoT where real-time processing and flexibility are required.
### Advantages:
- Tight PS-PL integration for low-latency communication.
- Power-efficient 28nm architecture.
For detailed specs, refer to Xilinx’s Zynq-7000 Technical Reference Manual.
### Key Features:
- Dual-core ARM Cortex-A9 (up to 1GHz) with NEON/FPU.
- Programmable Logic: Artix-7 FPGA fabric (~125K logic cells).
- Memory: 256KB on-chip RAM, DDR3/LPDDR2 support.
- I/O: High-speed interfaces (Gigabit Ethernet, USB, UART, SPI, I2C).
- Package: 676-pin BGA (FBG676).
### Applications:
Embedded systems, industrial automation, automotive, and IoT where real-time processing and flexibility are required.
### Advantages:
- Tight PS-PL integration for low-latency communication.
- Power-efficient 28nm architecture.
For detailed specs, refer to Xilinx’s Zynq-7000 Technical Reference Manual.
Equivalent
The XC7Z030-1FBG676I is a Zynq-7000 SoC from Xilinx (now AMD). Equivalent alternatives include:
- Xilinx Zynq-7000 family: XC7Z020, XC7Z045 (lower/higher specs).
- Intel (Altera) Cyclone V SoC: 5CSXFC6 (similar FPGA+ARM core).
- Microchip PolarFire SoC: MPFS250T (modern RISC-V alternative).
- AMD Versal ACAP: Zynq UltraScale+ or Versal (for newer designs).
Check pin compatibility and specs for exact replacements.
- Xilinx Zynq-7000 family: XC7Z020, XC7Z045 (lower/higher specs).
- Intel (Altera) Cyclone V SoC: 5CSXFC6 (similar FPGA+ARM core).
- Microchip PolarFire SoC: MPFS250T (modern RISC-V alternative).
- AMD Versal ACAP: Zynq UltraScale+ or Versal (for newer designs).
Check pin compatibility and specs for exact replacements.
Pinout
The XC7Z030-1FBG676I is a Zynq-7000 SoC from Xilinx (now AMD), featuring a dual-core ARM Cortex-A9 processor and FPGA fabric.
- Pin Count: 676 pins (FBG676 package).
- Key Functions:
- Processing System (PS): Dual-core ARM Cortex-A9, DDR3/LPDDR2 memory controllers, peripherals (USB, UART, SPI, I2C, Gigabit Ethernet).
- Programmable Logic (PL): Artix-7 FPGA fabric (~125K logic cells, 6.6Mb BRAM, 400 DSP slices).
- High-speed I/O: Supports PCIe, SATA, HDMI, and other interfaces.
- Power & Configuration: Multiple power rails, JTAG, and flash interfaces.
Used in embedded systems requiring high-performance processing and flexible logic.
- Pin Count: 676 pins (FBG676 package).
- Key Functions:
- Processing System (PS): Dual-core ARM Cortex-A9, DDR3/LPDDR2 memory controllers, peripherals (USB, UART, SPI, I2C, Gigabit Ethernet).
- Programmable Logic (PL): Artix-7 FPGA fabric (~125K logic cells, 6.6Mb BRAM, 400 DSP slices).
- High-speed I/O: Supports PCIe, SATA, HDMI, and other interfaces.
- Power & Configuration: Multiple power rails, JTAG, and flash interfaces.
Used in embedded systems requiring high-performance processing and flexible logic.
Manufacturer
The XC7Z030-1FBG676I is manufactured by Xilinx, now part of AMD following its acquisition in 2022.
Xilinx is a leading semiconductor company specializing in programmable logic devices, including FPGAs (Field-Programmable Gate Arrays) and SoCs (System-on-Chips). The XC7Z030-1FBG676I is part of the Zynq-7000 family, which combines FPGA fabric with ARM Cortex-A9 processors for embedded applications.
Xilinx (now AMD) is known for high-performance, adaptable computing solutions used in industries like aerospace, automotive, telecommunications, and AI.
Xilinx is a leading semiconductor company specializing in programmable logic devices, including FPGAs (Field-Programmable Gate Arrays) and SoCs (System-on-Chips). The XC7Z030-1FBG676I is part of the Zynq-7000 family, which combines FPGA fabric with ARM Cortex-A9 processors for embedded applications.
Xilinx (now AMD) is known for high-performance, adaptable computing solutions used in industries like aerospace, automotive, telecommunications, and AI.
Application
The XC7Z030-1FBG676I, a Zynq-7000 SoC from Xilinx (now AMD), integrates an ARM Cortex-A9 dual-core processor with FPGA logic. Key application areas include:
- Embedded Systems: Industrial automation, robotics, and motor control.
- Communications: Software-defined radio (SDR), baseband processing, and networking.
- Automotive: ADAS, infotainment, and vehicle networking.
- Aerospace & Defense: Radar, avionics, and secure communications.
- Medical Imaging: Real-time processing for ultrasound and MRI.
- Consumer Electronics: High-performance video processing and IoT edge devices.
Its hybrid architecture enables high-speed processing, flexibility, and low-latency control.
- Embedded Systems: Industrial automation, robotics, and motor control.
- Communications: Software-defined radio (SDR), baseband processing, and networking.
- Automotive: ADAS, infotainment, and vehicle networking.
- Aerospace & Defense: Radar, avionics, and secure communications.
- Medical Imaging: Real-time processing for ultrasound and MRI.
- Consumer Electronics: High-performance video processing and IoT edge devices.
Its hybrid architecture enables high-speed processing, flexibility, and low-latency control.
Package
The XC7Z030-1FBG676I is a Zynq-7000 SoC from Xilinx (now AMD). It comes in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package. The "FBG676" in the part number indicates the package type (FBGA) and ball count (676). This package is surface-mount, suitable for high-performance embedded applications. The "I" suffix denotes an industrial temperature range (-40°C to +100°C).
