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XCKU060-1FFVA1517C
+BOMIC FPGA 624 I/O 1517FCBGA
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제조업체AMD
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제조업체 부품 #XCKU060-1FFVA1517C
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재고8396
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사양
| 속성 | 가치 |
| Series | Kintex® UltraScale™ |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Total RAM Bits | 38912000 |
| Number of I/O | 624 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 1517-BBGA, FCBGA |
| Supplier Device Package | 1517-FCBGA (40x40) |
| Base Product Number | XCKU060 |
| Number of Logic Elements / Cells | 725550 |
| Number of LA Bs / CL Bs | 41460 |
개요
Description
Key specifications include support for various I/O standards, high-speed transceivers, and a wide range of memory interfaces. The architecture incorporates advanced features like variable precision DSP slices, enabling efficient signal processing. The device is manufactured using a 20nm process technology, offering a balance of performance and power efficiency.
The XCKU060-1FFVA1517C is housed in a FFG1517 package, allowing for a dense arrangement of I/O pins to facilitate connectivity. It is ideal for applications requiring high bandwidth and low latency, making it suitable for markets such as automotive, industrial automation, and aerospace. The device can be programmed using Xilinx's Vivado Design Suite, which supports RTL design, high-level synthesis, and system-level integration.
Equivalent
Features
1. Logic Cells: Approximately 60,000 logic cells, offering substantial processing capabilities.
2. DSP Slices: Equipped with around 220 DSP slices, optimized for high-speed arithmetic operations.
3. Memory: Supports up to 4.5 Mb of block RAM for efficient data storage and management.
4. I/O Capability: Features up to 320 user I/O pins with diverse I/O standards, including LVDS and LVCMOS.
5. Clocking Resources: Contains dedicated clock management tiles for enhanced performance.
6. Transceivers: Integrated high-speed serial transceivers supporting data rates up to 12.5 Gbps.
7. Power Efficiency: Focused on low power consumption while maintaining high performance.
8. Versatile Applications: Suitable for applications in telecommunications, automotive, industrial, and high-performance computing.
This FPGA balances performance and cost, making it ideal for a wide range of advanced applications.
Pinout
1. I/O Pins: Configurable as input, output, or bidirectional, supporting various signaling standards.
2. Power Pins: Dedicated pins for supplying power to the FPGA.
3. Clock Inputs: Pins for global clock inputs, which are essential for timing operations within the FPGA.
4. Configuration Pins: Used for programming the FPGA and for switching modes.
5. High-Speed Transceivers: Specific pins are designated for high-speed serial communications.
This versatile pin configuration allows for a wide range of applications, including digital signal processing, data communication, and high-performance computing.
Manufacturer
Application
1. Telecommunications: For high-speed data processing and signal processing.
2. Aerospace and Defense: In embedded systems for image processing and real-time data analysis.
3. Data Centers: For acceleration of network functions and data analytics.
4. Industrial Automation: In control systems and robotics for enhanced processing capabilities.
5. Medical Imaging: For high-performance processing in MRI and ultrasound systems.
6. Automotive: In advanced driver-assistance systems (ADAS) for real-time data processing.
Its versatility and performance make it suitable for demanding applications across multiple industries.