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XCKU085-2FLVA1517E
+BOMIC FPGA 624 I/O 1517FCBGA
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제조업체AMD
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제조업체 부품 #XCKU085-2FLVA1517E
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사양
| 속성 | 가치 |
| Series | Kintex® UltraScale™ |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Total RAM Bits | 58265600 |
| Number of I/O | 624 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 1517-BBGA, FCBGA |
| Supplier Device Package | 1517-FCBGA (40x40) |
| Base Product Number | XCKU085 |
| Number of Logic Elements / Cells | 1088325 |
| Number of LA Bs / CL Bs | 62190 |
개요
Description
This FPGA supports various interfaces, including PCIe, Ethernet, and high-speed serial transceivers, facilitating integration into diverse systems. The "2FLVA" package indicates a flip-chip ball grid array (BGA) form factor, enabling better thermal performance and signal integrity. Additionally, the device is equipped with advanced features such as dynamic partial reconfiguration and extensive DSP resources, ideal for applications in telecommunications, data centers, and industrial automation.
Overall, the XCKU085-2FLVA1517E is optimized for applications requiring high-bandwidth processing and flexibility, making it a popular choice among engineers working on sophisticated digital designs.
Equivalent
1. Intel Arria 10 GX 1150 FPGA
2. Lattice Semiconductor ECP5-5G
3. Microchip (formerly Actel) SmartFusion2
4. Xilinx Kintex UltraScale+ series (e.g., XCKU085-2FFVA1156E)
Always check specific requirements and features for compatibility.
Features
1. Architecture: Utilizes a 20nm process technology for enhanced performance and power efficiency.
2. Logic Cells: Offers approximately 85,000 logic cells, providing substantial design flexibility.
3. DSP Slices: Contains 840 DSP slices optimized for high-speed, complex mathematical computations, suitable for signal processing applications.
4. Memory: Equipped with up to 5.5 Mb of block RAM, allowing for efficient data storage and manipulation.
5. I/O Capabilities: Supports a wide range of I/O standards, including LVDS and HSTL, with up to 500 I/O pins.
6. Transceivers: Features up to 16 high-speed serial transceivers with data rates up to 12.5 Gbps, ideal for high-bandwidth applications.
7. Power Efficiency: Designed for lower power consumption, making it suitable for embedded and portable applications.
Overall, the XCKU085-2FLVA1517E combines flexibility, performance, and power efficiency for diverse applications in telecommunications, automotive, and data processing.
Pinout
Key functions include support for various I/O standards, memory interfaces, and advanced clock management. It is suitable for applications such as telecommunications, data centers, automotive, and industrial automation, providing flexibility and high processing capabilities. The FPGA architecture includes features like configurable logic blocks, DSP slices, and programmable interconnects, enabling designers to create custom hardware solutions tailored to specific application needs.
Manufacturer
Xilinx specializes in providing solutions for a wide range of applications, including data center, automotive, aerospace, industrial, and telecommunications. Their products enable engineers to create custom hardware solutions that can be reconfigured to meet specific processing needs, offering flexibility and efficiency in design. The XCKU085-2FLVA1517E is part of their Kintex UltraScale FPGA family, which is designed for high-performance applications requiring a balance of power efficiency and processing capability.
Application
1. Data Processing: High-speed data throughput in telecommunications and networking.
2. Signal Processing: Real-time processing for radar, audio, and video applications.
3. Embedded Systems: Integration in industrial control and automation.
4. Machine Learning: Acceleration of inference tasks in AI applications.
5. High-Performance Computing: Enhancements in computational tasks for scientific simulations.
6. Control Systems: Used in robotics and automation for real-time processing.
These applications leverage its parallel processing capabilities, high bandwidth, and flexibility.