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XCKU9P-2FFVE900I
+BOMIC FPGA 304 I/O 900FCBGA
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제조업체AMD
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제조업체 부품 #XCKU9P-2FFVE900I
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재고5351
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사양
| 속성 | 가치 |
| Series | Kintex® UltraScale+™ |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Number of Logic Elements / Cells | 599550 |
| Total RAM Bits | 41881600 |
| Number of I/O | 304 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| Base Product Number | XCKU9 |
| Number of LA Bs / CL Bs | 34260 |
개요
Description
Key specifications include 9 million logic cells, up to 900K logic elements, and extensive DSP resources for high-speed signal processing. The device supports various interfaces such as PCIe, Ethernet, and high-speed transceivers, enabling versatile connectivity options.
Its 16nm technology node allows for higher performance and lower power consumption compared to previous generations. The XCKU9P-2FFVE900I is particularly suited for applications requiring high throughput and real-time processing, such as machine learning, video processing, and software-defined networking.
Xilinx also provides a rich development environment, including Vivado Design Suite, which facilitates effective design, simulation, and debugging. Overall, the XCKU9P-2FFVE900I is ideal for engineers seeking a robust platform for innovative hardware solutions.
Equivalent
Features
1. Logic Cells: Approximately 9,000 logic cells for implementing complex designs.
2. DSP Slices: Up to 540 DSP slices for high-performance digital signal processing.
3. Memory: Integrated block RAM (BRAM) and UltraRAM for flexible memory storage options.
4. Transceivers: Supports up to 28 high-speed transceivers with data rates up to 28 Gbps.
5. I/O Pins: A wide variety of I/O standards and approximately 242 available pins for connectivity.
6. Power Efficiency: Designed for lower power consumption while maintaining high performance.
7. Versatility: Suitable for various applications, including data centers, telecommunications, and industrial systems.
The device is ideal for applications requiring high throughput, processing capabilities, and advanced connectivity features.
Pinout
The pins serve multiple functions, including power supply, ground, I/O configuration, and dedicated signals for programming, status, and clock inputs. The I/O pins are configurable for different standards, including LVDS, LVCMOS, and others. The device also supports various interfaces like PCIe, Ethernet, and high-speed serial communication.
In summary, the XCKU9P-2FFVE900I has 900 pins, serving a variety of functions to support advanced digital designs and applications.
Manufacturer
Founded in 1984, Xilinx has been a pioneer in the FPGA market, providing solutions for various applications including telecommunications, automotive, industrial, and consumer electronics. The company focuses on creating versatile hardware that can be configured for a wide range of processing tasks, offering high performance and flexibility. The XCKU9P specifically belongs to Xilinx's Kintex UltraScale+ family, designed for high-performance applications that require substantial computational power and efficiency.
Xilinx is recognized for its innovation in programmable logic devices and is a key player in the semiconductor industry, driving advancements in areas like artificial intelligence, machine learning, and data center solutions.
Application
1. Telecommunications: High-speed data processing, wireless communication systems, and network infrastructure.
2. Data Center Acceleration: Accelerating workloads in cloud computing and data analytics.
3. Automotive: Advanced driver-assistance systems (ADAS) and autonomous driving applications.
4. Broadcast and Video: Real-time video processing, encoding, and transcoding.
5. Industrial Automation: Control systems, robotics, and automation solutions.
6. Aerospace and Defense: Signal processing, radar and sonar systems, and secure communications.
Its high performance and flexibility make it suitable for demanding applications across multiple industries.