Part A
5CEFA9F27I7N
정보
- Lifecycle
- Active
- Stock
- 7586 PCS
- Package
- BGA-672
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Replacement verdict
Not a drop-in replacement
The 5CEFA9F27I7N and 5CEFA2M13C6N are not drop-in replacements for one another. They differ fundamentally in logic density, package footprint, and speed grade, making them suitable for entirely different design requirements rather than interchangeable use.
Different logic density
Different package footprint
Different speed grade
Different I/O count
Parts at a glance
Part B
5CEFA2M13C6N
정보
- Lifecycle
- Active
- Stock
- 4768 PCS
- Package
- TFBGA-383
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA9F27I7N | 5CEFA2M13C6N | Why it matters |
|---|---|---|---|
| Family / Series | Cyclone V E | Cyclone V E | Same FPGA family ensures toolchain, IP, and pinout conventions are compatible, easing design migration. |
| Logic Elements (LE) | 301,000 | 25,000 | LE count determines the amount of logic that can be implemented; a large mismatch prevents direct functional substitution. |
| Package | FBGA-672 | MBGA-383 | Different packages have different footprints and pin counts, so they are not drop-in compatible on the same PCB. |
| Operating Temperature Range | -40°C to 100°C (Industrial) | 0°C to 85°C (Commercial) | Temperature grade affects reliability in harsh environments; industrial parts are required for extended-temperature applications. |
| Speed Grade | 7 (fastest) | 6 (slower) | Speed grade determines maximum operating frequency and timing closure; a slower grade may not meet the same performance targets. |
| Embedded Memory (M10K blocks) | 1,220 | 140 | On-chip memory capacity limits buffering, FIFO, and data storage capability; a large difference restricts functional equivalence. |
| 18x18 Multipliers | 684 | 72 | DSP multiplier count determines signal-processing throughput; fewer multipliers limit arithmetic-intensive designs. |
| User I/O Pins | 336 | 224 | I/O count constrains the number of external interfaces; fewer pins may prevent connecting all required peripherals. |
| Transceiver Count | 9 | 0 | High-speed serial transceivers enable protocols like PCIe and Ethernet; their absence in one part blocks those interfaces entirely. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA9F27I7N | 5CEFA2M13C6N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 113560 | 9434 |
| Number of Logic Elements/Cells | 301000 | 25000 |
| Total RAM Bits | 14251008 | 2002944 |
| Number of I/O | 336 | 223 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA9F27I7N and the 5CEFA2M13C6N?
The 5CEFA9F27I7N is a larger Cyclone V FPGA in the F27 package with 301,000 logic elements, while the 5CEFA2M13C6N is a smaller Cyclone V device in the M13 package with 25,000 logic elements. They differ in logic density, package, I/O count, and speed grade.
Are the 5CEFA9F27I7N and 5CEFA2M13C6N pin-to-pin compatible?
No. The 5CEFA9F27I7N uses a 672-pin FBGA (F27) package, while the 5CEFA2M13C6N uses a 383-pin Micro FBGA (M13) package. The package sizes, ball counts, and pinouts are different, so they are not drop-in replacements.
What is the logic element count for each device?
The 5CEFA9F27I7N contains 301,000 logic elements. The 5CEFA2M13C6N contains 25,000 logic elements. These values are specified in the Intel Cyclone V device family datasheet.
What speed grades do these two FPGAs use?
The 5CEFA9F27I7N is specified with speed grade 7 (I7). The 5CEFA2M13C6N is specified with speed grade 6 (C6). Speed grade affects timing performance and must be considered when migrating designs.
Do both devices belong to the same FPGA family?
Yes. Both the 5CEFA9F27I7N and the 5CEFA2M13C6N are members of the Intel Cyclone V F-series FPGA family, which shares the same architecture, IP support, and development toolchain.
Can the 5CEFA2M13C6N be used as a direct substitute for the 5CEFA9F27I7N?
No. The 5CEFA2M13C6N has significantly fewer logic elements, fewer I/O pins, a different package, and a different speed grade. A direct substitution would require a full design re-evaluation and is not supported without redesign.
What package types are used by these two devices?
The 5CEFA9F27I7N is offered in a 672-ball FBGA package designated F27. The 5CEFA2M13C6N is offered in a 383-ball Micro FBGA package designated M13. Package dimensions and PCB land patterns differ between them.
Are both devices supported by the same development software?
Yes. Both the 5CEFA9F27I7N and the 5CEFA2M13C6N are supported by Intel Quartus Prime software, which provides device-specific fitting, timing analysis, and programming support for the Cyclone V family.