Part A
5CEFA9F27I7N
정보
- Lifecycle
- Active
- Stock
- 7586 PCS
- Package
- BGA-672
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Replacement verdict
Not a drop-in replacement
The 5CEFA9F27I7N and 5CEFA2M13C7N are not functionally interchangeable. They differ fundamentally in logic density, package footprint, and speed grade, making direct substitution impractical without a complete board redesign and revalidation.
Different logic density
Different package footprint
Different speed grade
Different I/O count
Parts at a glance
Part B
5CEFA2M13C7N
정보
- Lifecycle
- Active
- Stock
- 3960 PCS
- Package
- TFBGA-383
- Series
- 내장형 FPGA(현장 프로그래밍 가능한 도어 어레이)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA9F27I7N | 5CEFA2M13C7N | Why it matters |
|---|---|---|---|
| Family / Series | Cyclone V E FPGA | Cyclone V E FPGA | Same device family ensures toolchain, IP, and pinout compatibility for migration. |
| Logic Elements (LE) | 301,000 | 25,000 | LE count determines available logic capacity; a large mismatch prevents direct functional substitution. |
| Embedded Memory (M10K blocks) | 1,220 | 176 | On-chip memory affects buffering, FIFO depth, and data storage capability of the design. |
| 18x18 Multipliers | 684 | 66 | DSP block count limits arithmetic throughput for signal processing and math-intensive logic. |
| Package | FBGA-672 | MBGA-383 | Different packages have different footprints and pin counts, preventing drop-in board replacement. |
| Operating Temperature Range | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) | Temperature grade determines suitability for industrial versus commercial environments. |
| Speed Grade | 7 (Fastest) | 7 (Fastest) | Speed grade affects maximum clock frequency and timing closure margins. |
| Total I/O Pins | 336 | 224 | I/O count limits the number of external interfaces and peripherals the device can support. |
| Core Supply Voltage | 1.1 V | 1.1 V | Core voltage must match the board power design for correct operation. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA9F27I7N | 5CEFA2M13C7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 113560 | 9434 |
| Number of Logic Elements/Cells | 301000 | 25000 |
| Total RAM Bits | 14251008 | 2002944 |
| Number of I/O | 336 | 223 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA9F27I7N and the 5CEFA2M13C7N?
The 5CEFA9F27I7N is a Cyclone V FPGA with 301,000 logic elements, 13,917 Kbits of embedded memory, and 480 18x18 multipliers in a 672-pin FBGA package, rated for industrial temperature range (TJ = -40°C to 100°C). The 5CEFA2M13C7N is a Cyclone V FPGA with 25,000 logic elements, 1,864 Kbits of embedded memory, and 72 18x18 multipliers in a 383-pin Micro FBGA package, rated for commercial temperature range (TJ = 0°C to 85°C). The 5CEFA9F27I7N offers significantly higher logic density, memory, and DSP resources, while the 5CEFA2M13C7N provides a smaller footprint and lower power consumption for cost-sensitive applications.
Are the 5CEFA9F27I7N and 5CEFA2M13C7N pin-to-pin compatible?
No. The 5CEFA9F27I7N uses a 672-pin FBGA package (27 mm x 27 mm), while the 5CEFA2M13C7N uses a 383-pin Micro FBGA package (13 mm x 13 mm). The package sizes, ball counts, and ball maps are different, so they are not pin-to-pin compatible and cannot be interchanged on the same PCB without a redesign.
Can the 5CEFA2M13C7N be used as a direct replacement for the 5CEFA9F27I7N?
No. The two devices differ in logic density (25,000 vs. 301,000 logic elements), embedded memory (1,864 Kbits vs. 13,917 Kbits), DSP resources (72 vs. 480 multipliers), package type, pin count, and temperature grade. A direct replacement is not possible without verifying that the target design's logic, memory, DSP, I/O, and thermal requirements are met by the smaller device, which is unlikely for designs originally targeting the 5CEFA9F27I7N.
What are the operating temperature ranges for these two FPGAs?
The 5CEFA9F27I7N is specified for industrial temperature range with a junction temperature (TJ) of -40°C to 100°C. The 5CEFA2M13C7N is specified for commercial temperature range with a junction temperature (TJ) of 0°C to 85°C. The industrial-grade device is suitable for harsher environments, while the commercial-grade device is intended for controlled environments.
Which device offers lower power consumption?
The 5CEFA2M13C7N generally offers lower power consumption due to its smaller logic density, reduced embedded memory, fewer DSP blocks, and smaller package. However, actual power consumption depends on the specific design's resource utilization, clock frequencies, and I/O activity. Designers should use the manufacturer's power estimation tools with their specific configuration to obtain accurate power figures for either device.
Do both devices belong to the same FPGA family?
Yes. Both the 5CEFA9F27I7N and the 5CEFA2M13C7N are members of the Intel (formerly Altera) Cyclone V FPGA family. They share the same architecture, IP support, and development tools, but differ in logic capacity, memory, DSP resources, package, and temperature grade.
What package types are used by the 5CEFA9F27I7N and 5CEFA2M13C7N?
The 5CEFA9F27I7N is housed in a 672-pin FineLine BGA (FBGA) package with a 27 mm x 27 mm body size. The 5CEFA2M13C7N is housed in a 383-pin Micro FineLine BGA (MBGA) package with a 13 mm x 13 mm body size. The different package footprints and ball counts prevent direct PCB-level interchangeability.
Which device is more suitable for high-performance applications?
The 5CEFA9F27I7N is more suitable for high-performance applications because it provides 301,000 logic elements, 13,917 Kbits of embedded memory, and 480 18x18 multipliers, along with an industrial temperature range. The 5CEFA2M13C7N, with 25,000 logic elements, 1,864 Kbits of memory, and 72 multipliers, is better suited for low-power, cost-sensitive, and space-constrained designs.