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K4A8G085WB-BCRC

FBGA-78 Memory (ICs) RoHS

제조업체삼성
제조업체 부품 #K4A8G085WB-BCRC
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사양

속성	가치
Packaging	FBGA-78

개요

Description

The K4A8G085WB-BCRC is a high-performance memory chip, specifically a 1GB DDR3 (Double Data Rate 3) SDRAM (Synchronous Dynamic Random Access Memory) module. It is commonly used in various electronic devices, including smartphones, tablets, and other consumer electronics requiring efficient data processing and storage.
This chip operates at a voltage of 1.5V and supports data transfer rates of up to 1600 MT/s (mega-transfers per second), making it suitable for applications that demand high-speed data access. With a 512MBx16 configuration, the K4A8G085WB-BCRC is designed for seamless integration into systems requiring fast memory solutions.
Manufacturers appreciate its reliability and power efficiency, which contribute to improved battery life in portable devices. Overall, the K4A8G085WB-BCRC serves as a crucial component in enhancing the performance and responsiveness of modern electronics.

Equivalent

The K4A8G085WB-BCRC chip, a 1GB DDR3 SDRAM, can be equivalently replaced by similar DDR3 memory chips such as MT8JTF12864HZ-1G6E1 from Micron or H5TQ1G83AFR from Hynix. Ensure compatibility in terms of speed, voltage, and pin configuration when selecting alternatives. Always check the datasheets for specifics.

Features

The K4A8G085WB-BCRC is a 8 Gb (1 GB) DDR3 SDRAM memory chip produced by Samsung. Key features include:
1. Memory Type: DDR3 SDRAM, which offers faster data transfer rates compared to DDR2.
2. Density: 8 Gigabits (1 GB), suitable for various applications including smartphones, tablets, and other digital devices.
3. Speed: Operates at a data rate of 1066 MT/s (Mega Transfers per second), with a clock speed of 533 MHz.
4. Voltage: Operates at a low voltage of 1.5V, which helps reduce overall power consumption.
5. Package Type: Typically available in a TSOP (Thin Small Outline Package), making it suitable for compact designs.
6. Architecture: Features a x8 data organization, allowing efficient data handling.
7. Applications: Ideal for consumer electronics, computing devices, and embedded systems that require reliable performance and efficiency.
This combination of features makes the K4A8G085WB-BCRC a versatile choice for modern memory applications.

Pinout

The K4A8G085WB-BCRC is a 1GB DDR3 SDRAM memory chip manufactured by Samsung. It features a pin count of 78 pins. This memory chip operates at a voltage of 1.5V and supports data rates up to 1066 MT/s.
The primary function of the K4A8G085WB-BCRC is to serve as a volatile memory solution for various applications, including computing devices like laptops, desktops, and servers. It is designed for high-speed read and write operations, contributing to improved performance in multitasking and memory-intensive applications. The chip supports a 64-bit data width, making it suitable for use in dual-channel memory architectures.

Manufacturer

The manufacturer of the K4A8G085WB-BCRC is Samsung Electronics. Samsung is a South Korean multinational conglomerate primarily known for its electronics division, which is one of the largest in the world. The company produces a wide range of products, including semiconductors, consumer electronics, telecommunications equipment, and home appliances.
The K4A8G085WB-BCRC is a DRAM memory chip, specifically a 1GB DDR3 SDRAM, commonly used in various electronic devices such as smartphones, tablets, and computers. Samsung's semiconductor division is a leading player in the global memory market, known for innovation and high-quality products. The company invests heavily in research and development to advance semiconductor technology and maintain its competitive edge.
With a strong emphasis on quality and performance, Samsung has established itself as a key supplier in the electronics and technology sectors, contributing significantly to advancements in computing and mobile technologies.

Application

The K4A8G085WB-BCRC is a 1GB DDR3 DRAM chip primarily used in various consumer electronics and computing applications. Its key application areas include smartphones, tablets, laptops, and desktop computers, where it provides high-speed memory for efficient data processing. Additionally, it is utilized in gaming consoles, set-top boxes, and embedded systems that require reliable and fast memory performance. The chip’s low power consumption makes it suitable for portable devices, enhancing battery life while supporting multitasking and demanding applications.

Package

The K4A8G085WB-BCRC is packaged in a 78-ball TFBGA (Thin Fine Pitch Ball Grid Array) format, designed for compact installation and efficient thermal performance in electronic devices.

Frequently Asked Questions

Q: What is the packaging type of the K4A8G085WB-BCRC?
A: It is packaged in FBGA-78, a fine-pitch ball grid array package suitable for high-density PCB assembly.

Q: Is this component designed for DDR4 or DDR5 memory applications?
A: Based on the "K4A8G" part number prefix, it is a Samsung DDR4 SDRAM, typically used in computing and embedded systems.

Q: What is the typical operating voltage for this Samsung memory chip?
A: As a standard DDR4 component, it operates at 1.2V nominal, though verify specific datasheet for VDD and VPP requirements.

Q: Can this FBGA-78 package be hand-soldered for prototyping?
A: FBGA-78 requires reflow soldering; hand-soldering is not recommended due to fine pitch and hidden ball contacts.

Q: What is the storage temperature range for this component?
A: Typically -55°C to +150°C for dry-pack storage, based on Samsung's standard DDR4 handling guidelines.

Q: Is this part RoHS compliant?
A: RoHS status is not specified in the given parameters; consult the manufacturer’s latest datasheet or part marking for compliance.