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16Gbit 1.2V DDR4 SDRAM FBGA-96 Memory (ICs) RoHS
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제조업체삼성
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제조업체 부품 #K4AAG165WA-BIWE
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재고12695
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사양
| 속성 | 가치 |
| Packaging | FBGA-96 |
| Memory Format | DDR4 SDRAM |
| Memory Size | 16Gbit |
| Operating Temperature | -40℃~+95℃ |
| Voltage - Supply | 1.2V |
개요
Description
- Capacity: 16Gb (Gigabit) per chip.
- Speed: 2666 Mbps (DDR4-2666).
- Voltage: 1.2V (standard for DDR4).
- Organization: Likely x16 or x8 configuration.
- Applications: Servers, data centers, and enterprise systems requiring reliability and speed.
This chip is part of Samsung’s A-die family, optimized for low power consumption and high density. It supports ECC (Error Correction Code) for data integrity, making it suitable for critical workloads.
For exact specs, refer to the datasheet or Samsung’s official documentation.
Equivalent
- SK Hynix: H5ANAG6NCJR-VKC
- Micron: MT40A1G16RC-062E
- Nanya: NT5AD1024M16A4-HR
These are 16Gb (2GB) DDR4 chips with similar specs (speed, density, voltage). Always verify datasheets for exact compatibility.
Features
- Capacity: 16Gb (Gigabit)
- Organization: 2G x 8 (2 Gigabit x 8 banks)
- Speed: 2666 Mbps (DDR4-2666)
- Voltage: 1.2V (standard DDR4)
- CAS Latency (CL): 19 cycles
- Package: 78-ball FBGA
- Density per chip: 16Gb
- Operating Temperature: Industrial (-40°C to +95°C)
- Low Power: Supports auto-refresh & self-refresh modes
Designed for industrial applications, it ensures reliability in harsh environments.
Pinout
- Pin Count: 96-ball FBGA (Fine-pitch Ball Grid Array).
- Key Functions:
- Operates at 1.2V (standard DDR4 voltage).
- Speed grades up to 3200 Mbps.
- Supports 8-bit prefetch and bank groups for improved efficiency.
- Features on-die termination (ODT) and programmable CAS latency.
- Used in servers, networking, and high-performance computing.
This chip is designed for high-density, low-power applications.
Manufacturer
The company is one of the world's largest memory chip suppliers, competing with Samsung and Micron. It is part of the SK Group, a major conglomerate in South Korea. SK Hynix is known for its high-performance, reliable memory products used in data centers, AI, and consumer electronics.
Application
- Enterprise servers
- Data centers
- High-performance computing (HPC)
- Networking equipment (routers, switches)
- Cloud storage systems
It offers high speed (3200 Mbps), low power consumption, and reliability, making it ideal for applications requiring fast data processing and large memory capacity.
Package
Frequently Asked Questions
Q: What is the memory density and organization of this DDR4 SDRAM?
A: It has a 16Gbit density, typically organized as 2G x 8 for the K4AAG165WA-BIWE.
Q: Is this component suitable for industrial temperature applications?
A: Yes, its operating temperature range is -40℃ to +95℃, making it ideal for harsh environments.
Q: What is the recommended operating voltage for this memory chip?
A: It requires a standard DDR4 supply voltage of 1.2V, ensuring low power consumption.
Q: In which package type is this component available?
A: It is supplied in an FBGA-96 package, which is common for high-density DDR4 modules.
Q: Can this DDR4 chip be used in automotive or networking equipment?
A: Yes, with a -40℃ to +95℃ temperature range and 1.2V operation, it suits industrial, networking, and edge computing applications.
Q: What memory format does the K4AAG165WA-BIWE support?
A: It is a DDR4 SDRAM, compliant with JEDEC standards for synchronous dynamic random-access memory.
