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K4ZAF325BM-HC16
+BOM16Gbit GDDR6 SGRAM FBGA-180 Memory (ICs) RoHS
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제조업체삼성
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제조업체 부품 #K4ZAF325BM-HC16
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재고16814
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사양
| 속성 | 가치 |
| Packaging | FBGA-180 |
| Memory Format | GDDR6 SGRAM |
| Memory Size | 16Gbit |
개요
Description
Equivalent
1. Micron MT61K256M32 series
2. Hynix H56C8H24M series
3. Nanya NT6AN128M32 series
These products should have comparable speed, capacity, and voltage characteristics to ensure they meet similar performance requirements. Always check the specific datasheets to confirm compatibility.
Features
1. Capacity: Typically organized to offer high densities, often around 16Gb.
2. Speed: Supports high-speed data transfer rates, reaching up to 6400 MT/s, enhancing performance in high-demand applications.
3. Power Efficiency: Designed for low power consumption, which is crucial for mobile and portable devices, extending battery life.
4. Voltage: Operates at lower voltages (VDD2 range around 1.05V), contributing to energy efficiency.
5. Package Type: Usually available in compact package forms suitable for integration in small devices.
6. Applications: Ideal for use in smartphones, tablets, ultrabooks, and other devices requiring efficient memory solutions.
This chip is part of Samsung's efforts to provide advanced memory solutions that cater to the increasing demand for faster and more efficient memory in consumer electronics.
Pinout
1. Pin Count: The K4ZAF325BM-HC16 typically has 200 balls in its BGA (Ball Grid Array) package. This is common for LPDDR5 modules, though exact packages can vary.
2. Function: The primary function of the K4ZAF325BM-HC16 is to provide fast and efficient memory storage and retrieval, supporting data rates up to 6400 MT/s (megatransfers per second). As a LPDDR5 module, it is designed to consume lower power compared to previous generations, making it suitable for battery-powered devices like smartphones, tablets, and laptops. It supports a wide range of low-power features, including deep power-down modes and dynamic voltage scaling, to enhance energy efficiency.
Manufacturer
Application
1. Graphics Cards: Used in GPUs for gaming, 3D rendering, and graphics processing.
2. Gaming Consoles: Enhances performance and visual quality in video game consoles.
3. High-Performance Computing: Supports data-intensive tasks in supercomputing and AI workloads.
4. Networking Equipment: Utilized in routers and switches for faster data handling.
5. Automotive Systems: Powers advanced driver-assistance systems (ADAS) and in-car entertainment.
These applications benefit from GDDR6's high bandwidth and efficiency.
Package
Frequently Asked Questions
Q: What is the memory format of K4ZAF325BM-HC16?
A: It is a GDDR6 SGRAM, designed for high-bandwidth graphics and compute applications.
Q: What is the total memory size of this component?
A: The memory size is 16 Gbit (gigabit), commonly configured as 2GB per chip.
Q: What package type does this GDDR6 memory use?
A: It uses an FBGA-180 package (Fine-pitch Ball Grid Array with 180 balls).
Q: Is this component suitable for high-performance computing?
A: Yes, GDDR6 SGRAM is optimized for graphics cards, AI accelerators, and high-bandwidth memory applications.
Q: What is the speed grade or data rate implied by the "HC16" suffix?
A: The "HC16" suffix typically indicates a 16 Gbps data rate per pin, common for high-end GDDR6.
Q: Can this memory be used in automotive or industrial designs?
A: It depends on temperature range validation; GDDR6 is primarily designed for consumer/commercial graphics, but industrial variants may exist.
Q: What is the operating voltage for K4ZAF325BM-HC16?
A: Specific voltage is not provided, but GDDR6 typically uses 1.35V VDD and 1.8V VPP.