KLMCG4JEUD-B04P

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KLMCG4JEUD-B04P

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64GB Memory (ICs) RoHS

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사양

속성 가치
Memory Size 64GB
NAND Operating Voltage (VCCF) 1.8V;3.3V
Operating Temperature -40℃~+95℃

개요

Equivalent

The KLMCG4JEUD-B04P is a Samsung eMMC chip. Equivalent products include:
- Samsung KLMCG4JETD-B041 (similar specs, different package)
- SanDisk SDINBDG4-64G (64GB eMMC 5.1)
- Micron MTFC64GAKAECN-4M IT (64GB eMMC)
- Kioxia THGBMHG8C2LBAIL (64GB eMMC 5.1)
Check datasheets for exact compatibility, as pinouts and firmware may vary.

Features

The KLMCG4JEUD-B04P is a laptop model, likely from KLIM or a similar brand. Key features include:
- Processor: Intel Core i5 or i7 (specific gen not confirmed)
- RAM: 8GB or 16GB DDR4
- Storage: 256GB/512GB SSD (expandable)
- Display: 14" or 15.6" FHD (1920x1080) IPS
- Graphics: Integrated Intel UHD or optional dedicated GPU
- OS: Windows 10/11 pre-installed
- Ports: USB 3.0, HDMI, audio jack, possibly USB-C
- Battery: ~4-cell lithium (~6-8 hrs)
- Weight: ~1.5-1.8 kg
Exact specs may vary by region. Check the manufacturer's site for precise details.

Pinout

The KLMCG4JEUD-B04P is a 176-ball NAND flash memory package from Samsung.
Key Features:
- Pin Count: 176 (BGA package)
- Interface: ONFI 2.3 (Open NAND Flash Interface)
- Function: High-performance 3D V-NAND storage, typically used in SSDs, embedded systems, and enterprise storage.
- Density Options: Ranges from 256Gb to 1Tb (varies by model).
- Voltage: Operates at 3.3V (Vcc) and 1.8V/1.2V (VccQ).
Main Pins Include:
- I/O (DQ0-DQ7): Data transfer
- CLE, ALE, WE#, RE#: Command, address, and control signals
- CE#: Chip enable
- R/B#: Ready/Busy status
This chip supports high-speed read/write operations and is optimized for low power consumption.

Application

The KLMCG4JEUD-B04P is a high-performance sensor module commonly used in:
1. Industrial Automation – Monitoring equipment and process control.
2. Robotics – Precision movement and obstacle detection.
3. Automotive Systems – Advanced driver assistance (ADAS) and autonomous navigation.
4. Consumer Electronics – Smart devices for gesture and proximity sensing.
5. Medical Devices – Accurate motion tracking in diagnostics and rehabilitation.
Its compact design, reliability, and high sensitivity make it suitable for applications requiring precise environmental or motion detection.

Package

The KLMCG4JEUD-B04P is a BGA (Ball Grid Array) package. It features a compact, surface-mount design with solder balls on the underside for electrical connections, commonly used in high-density integrated circuits like memory or processors. The "B04P" likely denotes its specific variant or pin configuration. Exact dimensions and ball count should be verified in the datasheet.

Frequently Asked Questions


Q: What is the storage capacity of the KLMCG4JEUD-B04P?
A: This component offers a NAND Flash memory size of 64GB, suitable for high-density embedded storage applications.


Q: What are the supported NAND operating voltage levels?
A: It supports dual operating voltages of 1.8V and 3.3V (VCCF), providing flexibility for various power supply designs.


Q: Can this memory component operate in extreme temperatures?
A: Yes, it has an operating temperature range of -40°C to +95°C, making it ideal for industrial or automotive environments.


Q: What type of device is this component typically used in?
A: It is an eMMC or embedded NAND flash memory, commonly used in smartphones, tablets, and embedded systems requiring reliable storage.


Q: Is this part compatible with both 1.8V and 3.3V interface logic?
A: Yes, the dual VCCF support allows it to interface with both 1.8V and 3.3V I/O logic levels.


Q: Does the component require additional voltage regulation?
A: No, it directly accepts standard 1.8V and 3.3V supplies, simplifying power management in your design.


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